RF & Microwave
Radar, telemetry, receiver chains, RF front-ends, amplifiers, detectors, filters and distribution systems.
View RF capability →
Engineering services in Chennai, India
RF, Microwave, FPGA & Rugged Electronics Engineering Services
Indra Insignia designs, develops and validates custom RF/microwave subsystems, embedded FPGA cards, rugged electronics and automated test platforms for aerospace, defence, radar, telemetry and industrial hardware programs. Our team supports the full path from requirement review and architecture to schematic design, PCB layout, mechanical integration, prototype bring-up, validation and qualification support.
X-BandRF and microwave design support for radar, telemetry and communication subsystem applications.
100WRF power-handling design experience for CW and pulsed applications, where applicable.
24-LMultilayer PCB design experience for high-speed digital, mixed-signal and RF boards.
GSPSGSPS-class ADC/DAC interface and high-speed signal-processing support.
Client overview
What We Help You Build
Use this page as a practical map of our engineering services: RF front-ends, embedded processing cards, rugged assemblies, validation fixtures and legacy hardware replacement programs. Each section explains the customer need, our role and representative hardware areas.
NDA-ready engineering discussions
Embedded & FPGA
Control cards, high-speed acquisition, FPGA processing, ADC/DAC interfaces and diagnostics.
View FPGA capability →Rugged Electronics
Harsh-environment PCB assemblies, enclosures, EMI/EMC support and mechanical integration.
View rugged capability →Test & Validation
RF fixtures, bed-of-nails jigs, automated validation systems and production screening support.
View test capability →
Lifecycle coverage
From Requirement to Validated Hardware
We help customers move from an idea, specification, legacy module or compliance requirement into a clear engineering execution plan.
01Requirement
02Architecture
03Schematic Design
04PCB Layout
05Prototype
06Bring-up
07Validation
08Qualification Support
09Production Test
Service domains
Engineering Capabilities & Representative Hardware
Select a domain to see what the capability means, where it is used and which hardware examples are relevant. The structure is designed for technical review, procurement evaluation and early program discussions.
Legacy hardware re-engineering
Logical Interface Unit for High Power Amplifiers
Indra Insignia re-engineered an obsolete FPGA-based LIU module for an airborne transmitter control unit, working from limited baseline information and non-functional sample hardware. The project supported component obsolescence mitigation and operational continuity.
LIULogical Interface Unit replacement for high power amplifier control.
FPGASecure control logic and timing matrix redevelopment.
FFFForm-fit-function compatible module for deployment continuity.
Interface analysis: Physical trace mapping, bus analysis and multi-layer interconnect recovery from non-functional legacy samples.
Logic redevelopment: Register-level functional compatibility rebuilt inside a ruggedized Microsemi FPGA architecture.
Signal routing: Mechanical slot constraints maintained while improving internal power integrity and routing reliability.
Outcome: Developed a form-fit-function compatible LIU replacement module and supported system-level validation.
Core deployment
Outcome
Developed a form-fit-function compatible LIU replacement module and supported system-level validation for operational deployment.
RF & Microwave Subsystem Engineering
Custom RF and microwave subsystem design from DC to X-band for radar, telemetry, receiver chains, signal distribution and test applications.
Useful when you need a custom RF front-end, distribution network, detector or amplifier path.
Supports simulation, PCB layout, bring-up, RF tuning and subsystem validation.
Representative examples include amplifiers, detectors, filters, dividers, combiners and distribution units.
Design and validation capabilities
- S-band and X-band RF front-end, active-array radar module and transceiver subsystem design.
- Microstrip power dividers and high-power combiners supporting 8-way, 16-way and 24-way configurations.
- Low-noise amplifier and detector module design with noise figure targets below 1.5 dB, where applicable.
- Phase- and amplitude-matched RF distribution networks with typical targets of ±5° phase and ±1 dB amplitude balance.
- RF switches, filters, frequency distribution networks, synthesizers and hybrid RF subsystems supported by simulation, layout review and validation.
Representative delivered hardware
Dual Channel RF Amplifier
Designed for gain- and phase-matched signal paths in radar and Doppler Weather Radar configurations, with integrated DAC, ADC, attenuator and phase-shifter interfaces.
Frequency30 ± 3 MHz
ProcessorSTM32 Controller
ComplianceMIL-STD-461E/F
Dimensions210 x 124 x 40 mm
Four Channel RF Detector & Simulator Assembly
Developed for weather radar testing, communicating via 10/100 Mbps Ethernet and designed to interface directly with SSPA output channels.
FrequencyX-Band
ProcessorSTM32F767ZIT6
ComplianceMIL-STD-461E/F
Weight1.125 kg; ruggedized enclosure
S-Band Low Noise Amplifier
Dual-channel LNA block offering a 55 dB gain response, below 1.5 dB noise figure constraints and better than 60 dB harmonics rejection. Designed and validated to JSS 55555 requirements.
Noise Figure< 1.5 dB
Gain / Attn55 dB / 30 dB
Max Input200 mW
ComplianceJSS 55555, Ground Equipment
Dual Channel Detector Module
Operating across 10 to 400 MHz, housed inside an EMI/EMC shielded aluminum enclosure with pulse trigger inputs and a D-sub interface.
Frequency10 - 400 MHz
HousingAluminum Al-6061
InterfacesSMA / D-sub
FeaturesPulse Trigger
Calibration Switch Module
Developed for S-Band radar applications, supporting 32 multi-port calibration paths with tightly controlled amplitude and phase balances.
Channels32 port-to-port
Balance±1 dB amplitude / ±5° phase
Power Handling50 W forward/reverse
ProcessorM2S090 Core
S-Band Switched Filter Bank
A compact ceramic filter assembly operating across four passbands. Developed using Rogers R4350B substrate layers and an Al-6061 mechanical housing frame.
Passband Ripple< 0.5 dB
Insertion Loss6 dB Max
Interface1G Ethernet RGMII
Max Input Power30 dBm
8-Way Microstrip Power Divider
Custom passive RF microstrip power divider engineered for isolation, amplitude balance and rugged-environment operation.
Frequency9 - 10 GHz (X-Band)
Isolation20 dB Min
Balance0.5 dB / ±4° phase
Temperature-40°C to +70°C
16-Way Microstrip Power Divider
Custom microstrip line distribution divider layout built for S-Band parameters with minimized insertion limits.
Frequency3.1 - 3.5 GHz (S-Band)
Isolation20 dB Min
Balance0.5 dB / ±4° phase
Insertion Loss13.5 dB Max
RF Divider
24-Way Microstrip Power Divider
Corporate-feed 24-way S-band power divider designed for balanced RF distribution across output channels.
Frequency3.1 - 3.5 GHz (S-Band)
Isolation20 dB Min
Balance0.5 dB / ±4° phase
Temperature-40°C to +70°C
12-Way S-Band Power Combiner
Precision 12-way S-band RF combiner designed for constrained airborne and ground mechanical interfaces.
Frequency3.1 - 3.5 GHz
Phase Match< 5 degrees
Amp Match< 1 dB
EnvironmentAirborne / Ground
DC Power Distribution Box
Rugged DC power distribution unit for multi-channel vehicle-system integration and remote monitoring over 16-port RS-422 links.
Max PowerUp to 1.7 kW
Converter16-port RS-422
Dimensions565 x 350 x 221.5 mm
Op Temp55 ± 5°C
Embedded Computing & FPGA Systems
Embedded control and FPGA processing platforms using Xilinx Artix-7, Zynq UltraScale+ and Microsemi FPGA architectures for deterministic control, high-speed acquisition and system diagnostics.
Useful for radar, avionics, industrial control, diagnostics and high-speed data handling.
Supports FPGA/MCU architecture, ADC/DAC interfaces, digital buses and board-level validation.
Representative examples include display controllers, data acquisition cards and control cards.
Design and validation capabilities
- Avionics and industrial interfaces including MIL-STD-1553B, ARINC 429, VME, Ethernet and custom digital buses.
- High-speed ADC/DAC interface designs, including 12- to 18-bit devices and multi-channel acquisition up to GSPS-class rates.
- High-speed memory and serial interfaces including DDR3, DDR4, DDR5, LPDDR4/5, JESD204B and multi-lane PCIe.
- Firmware development for complex processing platforms, ARM Cortex microcontrollers and real-time operating environments.
Representative delivered hardware
Rugged Display Controller
Processing interface driven by Texas Instruments Sitara AM625 compute blocks. Features dual eMMC/OSPI flash booting logic and an on-board JTAG emulator debugger.
InterfacesVGA / HDMI
ComplianceEN 61326-1
RF Data Acquisition Card
Mixed-signal acquisition module with 2 GB memory and pulse-trigger control support.
StorageQSPI Flash
Net Interface1G RGMII
Radar PCB
ABCM Imaging Radar PCB
A compact 12-layer embedded high-density processing board featuring 80 MHz ADC sampling, power routing and AVB multi-queue protocols.
ADC Sampling80 MHz; I2C control
Ethernet10/100 Mbps and 1G
PCB Layers12-layer / 2 mm
FeaturesAVB multi-queue
Beam Former
ADAR - Beam Former
A compact beamforming module enabling antenna-level beam control and active radar front-end integration using true time delay.
Beamforming ICsADAR4002 / ADAR1000
PCB Layers10-layer layout
Dimensions125 x 113 mm
Operating Temp-20°C to +70°C
Antenna Card
Antenna Control Card
Scalable FPGA control node supporting active antenna array parameters and AESA layouts, complete with an on-board BITE diagnostics routine.
ProcessorXilinx Artix-7
Memory4 GB DDR4 / 8 GB SD
Control Lines32 TTL lines
ComplianceJSS 55555, Ground Equipment
MCU Card
MPC574xxx Control Card
A rugged control card for automotive, servo control and military vehicle control applications, supporting monitoring, communication and control functions in demanding environments.
ProcessorMPC574xxx MCU
Bus LinksEthernet, I2C, SPI
ComplianceMIL-STD-461E/F
Use CaseServo, vehicle control and radar simulation
Zynq MPSoC
ZYNQ MPSoC Control Card
A high-performance mixed-signal processing card based on Zynq UltraScale+ architecture for radar, transponder and signal processing applications requiring high-speed ADC/DAC interfaces and complex computation.
ProcessorZynq UltraScale+
ADC / DAC2 GHz / 500 MHz
Avionics BusARINC 429 / MIL-STD-1553B
PCB Layout24-layer board
Ethernet-to-SPI Control Card
FPGA-based communications converter designed to bridge core radar controller commands over securely isolated network interfaces to peripheral assemblies.
ProcessorXilinx Artix-7
ProtocolsUDP, TCP/IP, SPI
EnclosureMilled Al-6061
Dimensions150 x 180 x 45 mm
LIU Flex PCB
Flexible PCB and space-constrained interconnect solutions for compact electronic systems requiring tight mechanical integration, connector alignment and reliable signal routing.
FocusFlexible interconnect
Use CaseSpace-constrained assemblies
Rugged Electronics & Mechanical Integration
Rugged electronic assemblies, enclosures and mechanical integration designed for harsh aerospace, defence and industrial environments.
Useful when electronics must survive vibration, thermal, EMI/EMC and mechanical constraints.
Supports HDI layout, mechanical packaging, protection boards and qualification support.
Representative examples include monitoring PCBs and GaN bias/protection platforms.
Design and validation capabilities
- High-Density Interconnect engineering featuring micro-vias, stacked/staggered vias, blind/buried vias and back-drilling.
- Fine-pitch BGA layout down to 0.4 mm pitch with multilayer stack-up support up to 24+ layers.
- Pre-layout and post-layout Signal Integrity cross-talk mapping paired with post-layout Power Integrity DC IR drop analysis.
- Qualification support for MIL-STD-461E/F, MIL-STD-810, DO-160 and JSS 55555 requirements.
Representative delivered hardware
DMON PCB
DMON Control / Monitoring PCB
Thin, space-constrained monitoring PCB designed with mixed Rogers/FR-4 stack-up, fine trace spacing and controlled signal routing.
Base MaterialsRogers + FR4 layers
Surface FinishENIG
Trace Spacing0.25 mm minimum
Thickness0.325 mm thin
Bias Sequencing & Protection Card
Provides deterministic gate and drain bias sequencing for three GaN amplifier channels, monitoring critical RF parameters for immediate latched fault shutdowns.
FPGA EngineMicrosemi M25005
Input RailsSingle +50 V DC
TelemetryVSWR, temp, current
Pulse Enable< 100 ns protection/control
GaN Bias Card (6 Channel Platform)
An FPGA-based power management engine delivering independent gate and drain biasing loops for six concurrent high power GaN channels.
Channels6 independent paths
Input PowerDual +50 V / +28 V DC
ProtectionHardware latched
Environment-40°C to +71°C
Test Jig & Automated Validation Systems
Custom test jigs, RF fixtures, bed-of-nails systems and automated validation setups for PCB bring-up, RF testing and production screening.
Useful when boards or RF assemblies need faster bring-up, screening or production checks.
Supports bed-of-nails, RF test fixtures, calibration scripts and interface validation.
Representative examples include RF test jigs, NFTR jigs, AAAU jigs and CSM jig systems.
Operational processes and evaluation frameworks
- Custom acrylic and precision aluminum bed-of-nails fixtures matched to the PCB footprint.
- High durability pogo pin arrangements for zero-force verification of fine-pitch, multi-layer interconnects.
- Automated calibration scripts and diagnostic sweeps for telemetry and RF responses up to 3.5 GHz.
- Transient and over-current protection during low-power and mixed-voltage board bring-up.
Delivered system infrastructure and fixture assemblies
Wireless Communication Board - RF Test Jig
Automates characterization of active antenna assemblies and NFTR diagnostic interfaces for naval and aerospace applications.
ProcessorXilinx Artix-7
Power Link50 V input supply
I/O InterfacesLVDS, RS-422, UART
ComplianceJSS 55555, Ground Equipment
TSFM Simulator & NFTR Test Jig
A multi-functional diagnostic module built for high-speed waveform validation, trigger metrics mapping and peripheral interface testing up to 3.5 GHz.
ArchitectureXilinx Artix-7
Comm Rate1 Gbps Ethernet
Testing BoundsRS232, RS422, LVDS
FeaturesIsolated NFTR port
AAAU Test Jig Assembly
Configurable structural validation jig developed for active antenna array units and peripheral digital bus protocol verification.
ProcessorAMD / Xilinx FPGA
Bus InterfacesRS485, RS232, LVTTL
Network Rate10/100 Mbps link
ComplianceMIL-STD-461E/F
RFTO Test Jig
Engineered for high frequency verification, RF trace optimization and multi-band impedance matching with integrated low-loss coaxial signal tracking paths.
FrequencyUp to 18 GHz
ShieldingBetter than 60 dB isolation
RF InterfaceBlind-mate SMP
Impedance50 Ω coaxial
CSM Jig
Engineered for dense multi-rail power distribution checking and validation. Features high durability pogo pin configurations and transient isolated switching protection.
Logic Channels128 matrix nodes
Switching SpeedSub-µs isolation
Voltage RailsQuad-rail tracking
Bus LinksCAN, SPI, RS-422
Customer confidence
Engineering Depth, Presented Clearly
The page preserves technical specifications and hardware references while organizing them into a buyer-friendly path: overview, lifecycle, capability domain, project proof and engagement model.
NDA-ready assurance
Full engineering support from initial architecture and design through validation and production test.
Build-to-print, build-to-spec, turnkey development and reverse engineering models to match your project stage.
Qualification support for MIL-STD-461E/F, MIL-STD-810, DO-160 and JSS 55555 requirements.
Support for Non-Disclosure Agreements on sensitive aerospace, defence and industrial electronics programs.
Engagement tracks
Engineering Support at Every Starting Point
Start with released design files, a specification, a concept, an obsolete sample or an import-substitution need. We adapt the execution path to your project stage.
Build to Print
Customer provides approved design files; Indra supports fabrication, assembly, tuning and validation.
Build to Specification
Customer shares functional, electrical, mechanical and environmental requirements; Indra develops the design and validation approach.
Turnkey Development
Concept architecture, schematic design, PCB layout, component sourcing, assembly, bring-up, test and qualification support.
Reverse Engineering
Obsolete module redevelopment with mechanical, electrical and functional compatibility targets.
Import Substitution
Indigenous development of specialized electronics to reduce dependency on foreign supply chains.
Service questions
Common Questions Before a Technical Discussion
These answers help engineering, procurement and program teams understand how to approach an initial conversation with Indra Insignia.
What engineering services does Indra Insignia provide?
Indra Insignia supports RF and microwave subsystem design, FPGA and embedded systems, rugged electronics, test jig development, automated validation and legacy hardware reverse engineering.
Can the team support NDA-based aerospace and defence programs?
Yes. NDA-based discussions can be used for sensitive radar, telemetry, avionics, defence electronics and industrial hardware requirements.
Can you work from an obsolete or non-functional hardware sample?
Yes. The engineering team can assess available samples, map interfaces, recover design intent and develop form-fit-function compatible replacements where practical.
What information should we share for a first review?
Useful inputs include requirements, interface control documents, schematics or Gerbers if available, mechanical constraints, target standards, operating environment, production volume and validation expectations.
Discuss your requirement
Discuss Your RF, Embedded or Rugged Hardware Requirement
Share your RF subsystem, FPGA card, rugged electronics or automated test requirement with our engineering team for review. We can assess your specification and propose a practical execution path.
Applications include radar, telemetry, defence electronics, avionics support, naval systems, industrial electronics and automated testing.